发明名称 樹脂組成物、樹脂ワニス、プリプレグ、金属張積層板及びプリント配線板
摘要 PROBLEM TO BE SOLVED: To provide a resin composition excellent in dielectric characteristics, thermal resistance of cured product, shock resistance and desmear property, having low viscosity when formed into a varnish, further not containing halogens and having high flame resistance.SOLUTION: A resin composition contains (A) a polyarylene ether polymer having a phenolic hydroxyl group equivalence of 500 to 1500 at a molecular terminal, (B) an epoxy resin, (C) a three dimensionally crosslinked core shell fine particle having a rubber-based core and an acrylic shell and an average particle size of 1 μm or less, (D) at least one kind each of a resin dissolution type phosphorus-based flame retardant and a resin non-dissolution and dispersion type phosphorus-based flame retardant as phosphorus-based flame retardants, and (E) imidazole and a metallic soap as cure catalysts.
申请公布号 JP6064275(B2) 申请公布日期 2017.01.25
申请号 JP20120157248 申请日期 2012.07.13
申请人 パナソニックIPマネジメント株式会社 发明人 藤原 弘明;林 琳;北井 佑季
分类号 C08G59/62;C08J5/24;C08K5/098;C08K5/3445;C08K5/49;C08L51/04;C08L63/00;C08L71/12;H05K1/03 主分类号 C08G59/62
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