| 摘要 |
On a wiring board 21, first and second semiconductor detection device arrays 22a and 22b are arranged along a depth direction (Y-axial direction). Each of the first and the second semiconductor detection device arrays 22a and 22b is composed by arranging six semiconductor detection devices 23 1 through 23 6 in one line in an arrangement direction (X-axial direction). Guard members 28a and 28b are arranged one on each end in the arrangement direction. In the semiconductor detection devices 23 1 through 23 6 of the first and the second semiconductor detection device arrays 22a and 22b, a kth (k is one of the number from 1 to 6) semiconductor detection device 23k from a reference line Xa is arranged by being shifted from others by 1/2 of a gap PT of the semiconductor detecting devices 23 1 through 23 6 in the arrangement direction. |
