| 摘要 |
PROBLEM TO BE SOLVED: To provide a packing body for a wafer cassette that contributes to cost restriction, promotion for research development, equipment investment, and so on, and global environment, by reducing the number of components.SOLUTION: A packing body for a wafer cassette comprises a wafer cassette 1 for a semiconductor wafer W, and first and second cushioning bodies 30 and 40 sandwiching the wafer cassette 1 from above and below. The wafer cassette 1 comprises a cassette 2 for storing semiconductor wafers W in an upright alignment, and a lid 12 fitted to an upper part 6 of the cassette 2 such that the lid is freely attached or detached. A pair of side wall upper parts of the cassette 2 are bent into flanges 8. The lid 12 has a form with a substantially plate-like cross-section, and both side portions of at least its peripheral wall 13 are allowed to interfere with the flanges 8. The first and second cushioning bodies 30 and 40 are formed from opposite plates 31 and 41 and outer walls 37 and 48 extending from the opposite plates 31 and 41 and bent. Storing recesses 32 and 42 for partially accommodating the wafer cassette 1 are formed in the opposite plates 31 and 41. |
