发明名称 サスペンション用基板
摘要 PROBLEM TO BE SOLVED: To provide a substrate for suspension capable of preventing disconnection of a second wiring layer provided on a first wiring layer across an insulating layer and improving electrical characteristics.SOLUTION: A substrate for suspension includes: a metal substrate 20; a first insulating layer 22 provided on the metal substrate 20; a first wiring layer 10 provided on the first insulating layer 22; a second insulating layer 24 provided on the first wiring layer 10; and a second wiring layer 12 provided on the second insulating layer 24. In an overlapping region 14 where the second wiring layer 12 is disposed above the first wiring layer 10, the second wiring layer 12 has a wide width part 16 in which wire width W1 is wider than wire width W2 of other parts of the second wiring layer 12.
申请公布号 JP6065945(B2) 申请公布日期 2017.01.25
申请号 JP20150128715 申请日期 2015.06.26
申请人 大日本印刷株式会社 发明人 西 山 甚;成 田 祐 治;古 庄 宏 樹
分类号 G11B5/60;G11B21/21 主分类号 G11B5/60
代理机构 代理人
主权项
地址