| 摘要 |
PROBLEM TO BE SOLVED: To perform back cleaning of a substrate, carried into an exposure device, properly.SOLUTION: A substrate cleaning device has a substrate holding section for holding the back side of a wafer, and a cleaning mechanism 12 for cleaning the back side of the wafer held by the substrate holding section. The cleaning mechanism 12 has a brush 30 that is brought into contact with the back side of the wafer, a support member 31 provided on the surface of the brush 30 on the reverse side of the wafer, an electrode 32 provided on the surface of the support member 31 on the reverse side of the brush 30, and a power supply 34 for applying a voltage to the electrode 32. |
