发明名称 研磨パッド、研磨方法、および研磨パッドの製造方法
摘要 A polish pad including a polish region contributing to polishing of a polish object; and a polish layer being disposed in the polish region and including unfoamed segments comprising unfoamed resin and foamed segments comprising resin including independent pores. The unfoamed segments and the foamed segments of the polish layer are made of the same raw resin.
申请公布号 JP6067481(B2) 申请公布日期 2017.01.25
申请号 JP20130108923 申请日期 2013.05.23
申请人 株式会社東芝 发明人 渡邉 崇史
分类号 H01L21/304;B24B37/24;B24B37/26 主分类号 H01L21/304
代理机构 代理人
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