| 摘要 |
PROBLEM TO BE SOLVED: To provide a foreign matter removal device on a substrate which can prevent re-adhesion of foreign matters by cleaning the surface of the substrate efficiently in a short time regardless of size of the substrate, and to provide a die bonder having the same.SOLUTION: A foreign matter removal device comprises a pickup device to which a dicing film mounting a die on the surface is fixed, and a collet which sucks the die peeled off from the dicing film and mounts the die on a substrate coated with an adhesive, and removes foreign matters on the substrate in order to coat the substrate with the adhesive. The foreign matter removal device includes a cleaning nozzle where air blowing holes and air suction holes are integrated.SELECTED DRAWING: Figure 4 |
