| 摘要 |
A method for processing a substrate using a block copolymer including a hydrophilic polymer and a hydrophobic polymer, wherein a resist pattern is formed on a neutral layer, a wafer after the resist pattern is formed is coated with the block copolymer, the block copolymer is phase-separated into the hydrophilic polymer and the hydrophobic polymer, the phase-separated block copolymer is irradiated with an energy beam, a polar organic solvent is supplied, and dry gas is discharged to the substrate to eliminate the polar organic solvent from the surface of the substrate. |
