| 摘要 |
PROBLEM TO BE SOLVED: To provide: a novel addition-curable resin composition suitably usable as a resin material for heat radiation materials, semiconductor devices, and electronic components; a cured boy of the composition; and a method of producing the same.SOLUTION: A resin composition contains (A) a specific polyester-based mesogen-silicon compound copolymer containing, in one molecule, two or more unsaturated hydrocarbon groups obtainable by carrying out condensation using, as essential ingredients, a carboxylic acid ingredient containing a siloxane chain and aromatic diol of bicyclic or polycyclic aromatic having an unsaturated group on an aromatic ring; (B) an organohydrogenpolysiloxane having two or more SiH groups in one molecule; and (C) a platinum group metal catalyst. |
