发明名称 |
Method of fabricating a polymer frame with a rectangular array of cavities |
摘要 |
An array of chip sockets defined by an organic matrix framework surrounding sockets through the organic matrix framework and a method of fabrication, the chip sockets are characterized by being rectangular with smooth walls that meet at corners that have radii of curvature of less than 100 microns thereby facilitating a close fit of each socket to the intended chip size, enabling compact chip packaging and miniaturization. |
申请公布号 |
US9554469(B2) |
申请公布日期 |
2017.01.24 |
申请号 |
US201414561719 |
申请日期 |
2014.12.05 |
申请人 |
Zhuhai Advanced Chip Carriers & Electronic Substrate Solutions Technologies Co. Ltd. |
发明人 |
Hurwitz Dror;Huang Alex |
分类号 |
H05K1/09;H05K1/18;H05K1/02;H05K1/03;H05K1/11;C23F1/02 |
主分类号 |
H05K1/09 |
代理机构 |
Wiggin and Dana LLP |
代理人 |
Wiggin and Dana LLP ;Rosenblatt Gregory S.;Hall Jonathan D. |
主权项 |
1. A framework defining an array of rectangular cavities, each of said cavities for receiving a rectangular chip, said framework comprising a dielectric material comprising a polymer matrix with at least one of glass fibers and ceramic fillers embedded therein and the framework further comprising via posts embedded within the polymer matrix. |
地址 |
Zhuhai CN |