发明名称 Method of fabricating a polymer frame with a rectangular array of cavities
摘要 An array of chip sockets defined by an organic matrix framework surrounding sockets through the organic matrix framework and a method of fabrication, the chip sockets are characterized by being rectangular with smooth walls that meet at corners that have radii of curvature of less than 100 microns thereby facilitating a close fit of each socket to the intended chip size, enabling compact chip packaging and miniaturization.
申请公布号 US9554469(B2) 申请公布日期 2017.01.24
申请号 US201414561719 申请日期 2014.12.05
申请人 Zhuhai Advanced Chip Carriers & Electronic Substrate Solutions Technologies Co. Ltd. 发明人 Hurwitz Dror;Huang Alex
分类号 H05K1/09;H05K1/18;H05K1/02;H05K1/03;H05K1/11;C23F1/02 主分类号 H05K1/09
代理机构 Wiggin and Dana LLP 代理人 Wiggin and Dana LLP ;Rosenblatt Gregory S.;Hall Jonathan D.
主权项 1. A framework defining an array of rectangular cavities, each of said cavities for receiving a rectangular chip, said framework comprising a dielectric material comprising a polymer matrix with at least one of glass fibers and ceramic fillers embedded therein and the framework further comprising via posts embedded within the polymer matrix.
地址 Zhuhai CN