发明名称 Light-emitting diode module and motor vehicle headlight
摘要 A light-emitting diode module includes a carrier and a plurality of optoelectronic semiconductor chips mounted on a carrier top and configured to generate primary radiation. The semiconductor chips are arranged in part at a first distance and in part at a second, greater distance from one another. Between the adjacent semiconductor chips arranged at the first distance from one another there is located a radiation-transmissive first filling for optical coupling. Between the adjacent semiconductor chips arranged at the second distance from one another there is located a radiation-opaque second filling for optical isolation.
申请公布号 US9553078(B2) 申请公布日期 2017.01.24
申请号 US201314411425 申请日期 2013.05.31
申请人 OSRAM Opto Semiconductors GmbH 发明人 Eichenberg Boris;Holz Jürgen
分类号 F21V9/16;H01L33/50;H01L25/075;H01L33/48;H01L33/54;F21S8/10;H01L33/56;H01L33/60;H01L33/62 主分类号 F21V9/16
代理机构 DLA Piper LLP (US) 代理人 DLA Piper LLP (US)
主权项 1. A light-emitting diode module comprising: a carrier with a carrier top, a plurality of optoelectronic semiconductor chips mounted on the carrier top and configured to generate primary radiation, a radiation-transmissive first filling, and a radiation-opaque second filling,wherein the semiconductor chips display in part a first distance and in part a second, larger distance from one another, the first filling is located between the adjacent semiconductor chips arranged at the first distance from one another for optical coupling of the adjacent semiconductor chips with one another, the second filling is located between the adjacent semiconductor chips arranged at the second distance from one another for optical isolation of the adjacent semiconductor chips from one another, at least one trench is formed in the carrier, and the trench is formed at least or only between adjacent semiconductor chips arranged at the greater, second distance from one another.
地址 DE