Method for manufacturing optical engine packages and apparatus from which optical engine packages are manufactured

摘要

The present disclosure relates to a method for manufacturing one or more optical engine packages, each optical engine package comprising a silicon photonic die. The method includes receiving a substrate comprising a package portion and a cutting area adjacent to the package portion, assembling the optical engine package on the substrate such that an edge-coupled waveguide of the silicon photonic die overlaps a boundary between the cutting area and the package portion, and cutting the optical engine package and the substrate in the cutting area to expose the edge-coupled waveguide for optical coupling thereof to an optical fiber core.

主权项

1. A method for manufacturing one or more optical engine packages, the method comprising:
receiving an apparatus comprising: a substrate comprising a package portion and an adjacent cutting area; a first optical engine package comprising an edge-aligned silicon photonic die having an edge-coupled waveguide, the optical engine package disposed on both the package portion and the adjacent cutting area such that the edge-coupled waveguide of the silicon photonic die overlaps a boundary between the cutting area and the package portion; a molding encapsulating the silicon photonic die and the substrate; and cutting the apparatus, including the first optical engine package and the substrate, to expose the edge-coupled waveguide for optical coupling thereof to an optical fiber core.