发明名称 |
Headphone socket assembly and electronic equipment including same |
摘要 |
A headphone socket assembly for use in electronic equipment, includes: a headphone socket electrically connected to a circuit board in the electronic equipment; and an electromagnetic shielding device disposed at a periphery of the headphone socket. |
申请公布号 |
US9553382(B2) |
申请公布日期 |
2017.01.24 |
申请号 |
US201414585297 |
申请日期 |
2014.12.30 |
申请人 |
Xiaomi Inc. |
发明人 |
Sun Wei;Guo Feng;Lei Zhenfei |
分类号 |
H01R12/77;H01R24/58;H01R12/72;H01R13/6594 |
主分类号 |
H01R12/77 |
代理机构 |
Finnegan, Henderson, Farabow, Garrett & Dunner LLP |
代理人 |
Finnegan, Henderson, Farabow, Garrett & Dunner LLP |
主权项 |
1. A headphone socket assembly for use in electronic equipment, comprising:
a headphone socket electrically connected to a circuit board in the electronic equipment; and an electromagnetic shielding device disposed at a periphery of the headphone socket, the electromagnetic shielding device being in contact with the headphone socket and providing no holding rib for holding the headphone socket; wherein one or more pins of the headphone socket are electrically connected to one or more conductive tracks on the circuit board via one or more welding points corresponding to the one or more pins, respectively; and the electromagnetic shielding device includes an electromagnetic shielding cover which covers the headphone socket and the one or more welding points on the circuit board, and the electromagnetic shielding cover is grounded through the circuit board. |
地址 |
Beijing CN |