Interconnect structure having smaller transition layer via

摘要

An interconnect structure including a bottom layer over a substrate, where the bottom layer includes at least one bottom layer line and at least one bottom layer via. The interconnect structure further includes a transition layer over the bottom layer, where the transition layer includes at least one transition layer line and at least one transition layer via. The interconnect structure further includes a top layer over the transition layer, where the top layer includes at least one top layer line and at least one top layer via. The at least one transition layer via has a cross sectional area at least 30% less than a cross sectional area of the at least one top layer via.

主权项

1. An integrated circuit comprising:
a first interconnect structure comprising
a first bottom layer over a substrate, wherein the first bottom layer comprises a first bottom layer line and a first bottom layer via,a first transition layer over the first bottom layer, wherein the first transition layer comprises a first transition layer line and a first transition layer via, and the first transition layer via is physically connected to the first transition layer line, anda first top layer over the transition layer, wherein the first top layer comprises a first top layer line and a first top layer via; and a second interconnect structure comprising
a second bottom layer over the substrate, wherein the second bottom layer comprises a second bottom layer line and a second bottom layer via,a second transition layer over the second bottom layer, wherein the second transition layer comprises a second transition layer line and a second transition layer via, and the second transition layer via is physically connected to the second transition layer line, anda second top layer over the transition layer, wherein the second top layer comprises a second top layer line and a second top layer via, wherein a width of the first transition layer line is less than a width of the second transition layer line, and a pitch between the first transition layer line and the second transition layer line is greater than a pitch between the first transition layer via and the second transition layer via.