Semiconductor cooling apparatus

摘要

An apparatus for cooling semiconductor elements uses heat exchangers to transfer heat from the semiconductor elements to a coolant flowing through the heat exchangers. A central body, made from a flexible material, is positioned between the heat exchangers and a manifold from which the coolant is provided. The central body includes a plurality of flexible runners fluidly coupled to each heat exchanger and the manifold to provide the coolant to the heat exchanger. Heat is transferred away from the semiconductor elements by the coolant and heated coolant is returned from the heat exchanger to the manifold. Each flexible runner is configured to flex to conform to a height of a respective semiconductor element and thereby apply a force to the heat exchanger to maintain contact with the semiconductor element.

主权项

1. A semiconductor cooling apparatus, comprising:
a thermal assembly configured to thermally couple to an array of semiconductor elements, the assembly comprising:
a plurality of heat exchangers, each heat exchanger configured to transfer heat from a respective semiconductor element to a coolant flowing through the respective heat exchanger;a plurality of supply flexible runners and a plurality of return flexible runners, each supply flexible runner fluidly coupled to pass coolant to the respective heat exchanger and each return flexible runner fluidly coupled to exhaust coolant returned from the respective heat exchanger, each flexible runner configured to flex to conform to a height of a respective semiconductor element and to apply a force to the respective heat exchanger to maintain contact of the respective heat exchanger with the respective semiconductor element; anda manifold fluidly coupled to the plurality of supply flexible runners and the plurality of return flexible runners, the manifold configured to supply coolant to the supply flexible runners and to exhaust returned coolant from the return flexible runners, the manifold comprising upper and lower planar surfaces and a sidewall,wherein each of the supply flexible runners and the return flexible runners extends from the sidewall of the manifold,wherein each of the supply flexible runners and the return flexible runners comprises respective upper and lower planar surfaces, andwherein the respective lower planar surfaces of the supply flexible runners, the return flexible runners and the manifold are co-planar with one another.