Selective soldering system

摘要

The invention relates to a selective soldering plant for the soldering of electronic circuit boards, at least one container for liquid solder, a soldering arrangement with at least one soldering nozzle and at least one pump for conveying the liquid solder to the soldering arrangement being provided, an inner shielding device for at least partially shielding the soldering arrangement upwardly with regard to a gas flow being provided above the soldering arrangement, and an inflow device being provided, through which gas, in particular protective gas, can in any event flow into the region below the inner shielding device. It is proposed that an outer shielding device for at least partially shielding the inner shielding device upwardly with regard to a gas flow be provided.

主权项

1. A selective soldering plant for soldering an article, comprising:
a gripper for the article to be soldered; a container configured to contain liquid solder; a soldering arrangement including at least one soldering nozzle; a pump configured to convey the liquid solder to the soldering arrangement; an inner shielding device configured to at least partially shield against upward gas flow, the inner shielding device being lowerable by an action force of the gripper for the article to be soldered; an inflow device configured to allow protective gas to flow into the region below the inner shielding device; and an outer shielding device configured to shield at least partially a region above the inner shielding device with regard to the gas flow.