Landside stiffening capacitors to enable ultrathin and other low-Z products

摘要

Embodiments of systems, devices, and methods to minimize warping of ultrathin IC packaged products are generally described herein. In some embodiments, an apparatus includes an IC mounted on a package substrate, and a capacitive stiffener subassembly mounted on the package substrate. The capacitive stiffener subassembly includes a plurality of capacitive elements electrically connected to contacts of the IC.

主权项

1. An apparatus comprising:
an integrated circuit (IC) mounted on a first side of an IC package substrate; solder bumps arranged on a second side of the package substrate; and a capacitive stiffener subassembly mounted on the second side of the package substrate, wherein the capacitive stiffener subassembly includes a plurality of capacitors embedded in stiffening material, electrically connected to contacts of the IC, and arranged substantially around the perimeter of the IC package substrate, wherein the capacitors are alternated with regions of the stiffening material in a lateral direction along the perimeter, and wherein the solder bumps are arranged within the perimeter and extend above a height of the capacitive stiffener subassembly.