| 发明名称 | Apparatus for controlling heat flow | ||
| 摘要 | An apparatus configured to control a heat flow is provided. The apparatus may include a semiconductor device region formed in a matrix; a heat rectifier region formed adjacent to the semiconductor device region; and a heat flow blocker formed in at least one region contacting the semiconductor device region and the heat rectifier region. | ||
| 申请公布号 | US9553083(B2) | 申请公布日期 | 2017.01.24 |
| 申请号 | US201514804830 | 申请日期 | 2015.07.21 |
| 申请人 | SAMSUNG ELECTRONICS CO., LTD.;SNU R&DB FOUNDATION | 发明人 | Park Yeonsang;Lee Byoungho;Hwang Sungwoo;Roh Younggeun;Lee Changwon |
| 分类号 | H01L23/34;H01L27/02;H01L23/373 | 主分类号 | H01L23/34 |
| 代理机构 | Sughrue Mion, PLLC | 代理人 | Sughrue Mion, PLLC |
| 主权项 | 1. An apparatus configured to control a heat flow, the apparatus comprising: a semiconductor device region formed in a matrix; a heat rectifier region formed adjacent to the semiconductor device region; and a heat flow blocker formed in at least one region contacting the semiconductor device region and the heat rectifier region, wherein the heat flow blocker comprises internal materials distributed in a matrix material layer. | ||
| 地址 | Suwon-Si KR | ||