| 发明名称 | Semiconductor device package and method of manufacturing the same | ||
| 摘要 | A semiconductor device package includes a substrate, electrical components disposed on the substrate, and a conductive frame disposed on the substrate. The conductive frame includes a top portion including at least one opening, a rim connected to the top portion and surrounding the electrical components, and a compartment extending from the top portion of the conductive frame and separating one or more of the electrical components from others of the electrical components. The semiconductor device package further includes an electromagnetic interference shield in contact with the top portion and the rim of the conductive frame. | ||
| 申请公布号 | US9553072(B2) | 申请公布日期 | 2017.01.24 |
| 申请号 | US201615228957 | 申请日期 | 2016.08.04 |
| 申请人 | ADVANCED SEMICONDUCTOR ENGINEERING, INC. | 发明人 | Yang Tau-Jing;Huang Kuo-Feng;Nien Wei Yu |
| 分类号 | H01L25/065 | 主分类号 | H01L25/065 |
| 代理机构 | Foley & Lardner LLP | 代理人 | Foley & Lardner LLP ;Liu Cliff Z. |
| 主权项 | 1. A semiconductor device package, comprising: a substrate; a plurality of electrical components disposed on the substrate; a conductive frame disposed on the substrate, the conductive frame including: a top portion including at least one opening;a rim connected to the top portion and surrounding the electrical components; andat least one compartment extending from the top portion of the conductive frame and separating one or more of the electrical components from others of the electrical components; and an electromagnetic interference shield in contact with the top portion and the rim of the conductive frame. | ||
| 地址 | Kaosiung TW | ||