发明名称 |
Plasma cleaning apparatus and method |
摘要 |
Embodiments of the present invention generally include an apparatus for plasma cleaning and a method for plasma cleaning. The apparatus can include a lid body having a first surface for facing a pedestal during cleaning and a second surface opposite the first surface and substantially parallel to the first surface, the second surface having a first indentation sized to receive a magnet assembly, one or more handles coupled to the second surface of the lid body, and the magnet assembly resting in the first indentation. The method can include removing a sputtering target from the processing chamber, sealing the processing chamber, introducing a gas into the processing chamber, applying an RF bias to a pedestal within the processing chamber, maintaining the pedestal at a substantially constant temperature, and removing material from the pedestal to clean the pedestal. |
申请公布号 |
US9552968(B2) |
申请公布日期 |
2017.01.24 |
申请号 |
US201414277010 |
申请日期 |
2014.05.13 |
申请人 |
APPLIED MATERIALS, INC. |
发明人 |
Deehan Martin;Tsai Matt Cheng-Hsiung;Lu Nan;Or David T.;Chang Mei |
分类号 |
B08B7/04;H01J37/32;B08B7/00;H01L21/67 |
主分类号 |
B08B7/04 |
代理机构 |
Patterson & Sheridan, LLP |
代理人 |
Patterson & Sheridan, LLP |
主权项 |
1. A method for cleaning a processing chamber, comprising:
removing a sputtering target from the processing chamber; sealing the processing chamber; introducing a gas into the processing chamber; applying an RF bias to a pedestal within the processing chamber; maintaining the pedestal at a substantially constant temperature; and removing material from the pedestal to clean the pedestal. |
地址 |
Santa Clara CA US |