Metal liftoff tools and methods

摘要

In certain embodiments the metal liftoff tool comprises an immersion tank for receiving a wafer cassette with wafers therein, the immersion tank including an inner weir, a lifting and lowering mechanism capable of raising and lowering the wafer cassette while submerged in fluid in the immersion tank, low pressure high velocity primary spray jets for stripping the metal, the primary spray jets positioned at opposing sides of the immersion tank parallel to the wafer surfaces planes, and secondary spray jets for pressure equalization force, positioned at the bottom of the immersion tank. A wafer lift insert is positioned at the bottom of the immersion tank to receive and periodically lift the wafers within the cassette.

主权项

1. A metal liftoff apparatus comprising:
a. an immersion tank having a first and second opposing sidewalls and a bottom, the immersion tank dimensioned to receive a cassette of wafers and a working fluid; b. primary spray jets positioned on the first and second opposing side walls of the immersion tank; c. secondary spray jets positioned on the bottom of the immersion tank; d. a stationary lifting assembly positioned at the bottom of the immersion tank for lifting the wafers a distance from a bottom portion of the cassette such that all portions of the wafer surfaces are exposed to the primary spray jets while submerged in the immersion tank; and e. a lifting and lowering mechanism connectable to a cassette of wafers configured to raise and lower the cassette of wafers while in the cassette of wafers remains submerged in the immersion tank.