发明名称 |
Molding material for package |
摘要 |
A molding material for package includes a matte-coating layer having excellent formability, chemical resistance, solvent resistance, electrolytic solution resistance and printing property. The molding material for package includes an outer base material layer including a heat-resistant resin; an inner sealant layer including a thermoplastic resin; a metal foil layer disposed between the outer base material layer and the inner sealant layer; and a matte-coating layer formed on a side opposite to the metal foil layer of the outer base material layer, wherein the matte-coating layer is a multilayer including a bottom layer including a resin composition including a main agent resin including a phenoxy resin and a urethane resin, a curing agent, and solid fine particles; and an upper layer including a resin composition including a fluorine-containing resin. |
申请公布号 |
US9553284(B2) |
申请公布日期 |
2017.01.24 |
申请号 |
US201414511285 |
申请日期 |
2014.10.10 |
申请人 |
SHOWA DENKO PACKAGING CO., LTD. |
发明人 |
Minamibori Yuji;Wang Honglin |
分类号 |
H01M2/02;B32B15/08;B32B7/12;B32B15/20;B32B27/34;B32B27/36 |
主分类号 |
H01M2/02 |
代理机构 |
Keating and Bennett, LLP |
代理人 |
Keating and Bennett, LLP |
主权项 |
1. A molding material for package comprising:
an outer base material layer comprising a heat-resistant resin; an inner sealant layer comprising a thermoplastic resin; a metal foil layer disposed between the outer base material layer and the inner sealant layer; and a matte-coating layer formed on a side of the outer base material layer that is opposite to another side of the outer base material layer on which the metal foil layer is disposed, wherein the matte-coating layer includes:
a bottom layer including:
a resin composition including:
a main resin including a phenoxy resin and a urethane resin;a curing agent; andsolid fine particles; andan upper layer comprising a resin composition including a fluorine-containing resin. |
地址 |
Kanagawa JP |