发明名称 Molding material for package
摘要 A molding material for package includes a matte-coating layer having excellent formability, chemical resistance, solvent resistance, electrolytic solution resistance and printing property. The molding material for package includes an outer base material layer including a heat-resistant resin; an inner sealant layer including a thermoplastic resin; a metal foil layer disposed between the outer base material layer and the inner sealant layer; and a matte-coating layer formed on a side opposite to the metal foil layer of the outer base material layer, wherein the matte-coating layer is a multilayer including a bottom layer including a resin composition including a main agent resin including a phenoxy resin and a urethane resin, a curing agent, and solid fine particles; and an upper layer including a resin composition including a fluorine-containing resin.
申请公布号 US9553284(B2) 申请公布日期 2017.01.24
申请号 US201414511285 申请日期 2014.10.10
申请人 SHOWA DENKO PACKAGING CO., LTD. 发明人 Minamibori Yuji;Wang Honglin
分类号 H01M2/02;B32B15/08;B32B7/12;B32B15/20;B32B27/34;B32B27/36 主分类号 H01M2/02
代理机构 Keating and Bennett, LLP 代理人 Keating and Bennett, LLP
主权项 1. A molding material for package comprising: an outer base material layer comprising a heat-resistant resin; an inner sealant layer comprising a thermoplastic resin; a metal foil layer disposed between the outer base material layer and the inner sealant layer; and a matte-coating layer formed on a side of the outer base material layer that is opposite to another side of the outer base material layer on which the metal foil layer is disposed, wherein the matte-coating layer includes: a bottom layer including: a resin composition including: a main resin including a phenoxy resin and a urethane resin;a curing agent; andsolid fine particles; andan upper layer comprising a resin composition including a fluorine-containing resin.
地址 Kanagawa JP