| 发明名称 |
COVER FOR ELECTRONIC DEVICE, ANTENNA ASSEMBLY, ELECTRONIC DEVICE, AND METHOD FOR MANFUACTURING THE SAME |
| 摘要 |
A cover for an electronic device may include a metal plate having a first metal region formed of a metal; a through-hole formed in a portion of the first metal region of the metal plate; and an electrical open path extending from the through-hole to an end portion on one side of the first metal region through metal oxidation. |
| 申请公布号 |
US2017019510(A1) |
申请公布日期 |
2017.01.19 |
| 申请号 |
US201615281541 |
申请日期 |
2016.09.30 |
| 申请人 |
SAMSUNG ELECTRO-MECHANICS CO., LTD. |
发明人 |
JEON Dae Seong;KIM Jong Lae;CHOI Kang Ryong |
| 分类号 |
H04M1/02;C25D11/02;C25D11/04;C25D11/26;H01Q1/24;C25D11/30 |
主分类号 |
H04M1/02 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A cover for an electronic device, the cover comprising:
a metal plate having a first metal region formed of a metal; a through-hole formed in a portion of the first metal region of the metal plate; and an insulating region extending from the through-hole to an end of the first metal region. |
| 地址 |
Suwon-si KR |
