| 摘要 |
An assembling method, a manufacturing method, a device and an electronic apparatus of flip-die are disclosed. The method for assembling a flip-die, comprises: temporarily bonding the flip-die (205) onto a laser-transparent first substrate (204), wherein bumps (202) of the flip-die (205) are located on the side of the flip-die (205) opposite to the first substrate (204); aligning the bumps (202) with pads (206) on a receiving substrate (207); irradiating the original substrate with laser (208) from the first substrate side to lift-off the flip-die (205) from the first substrate (204); and attaching the flip-die (205) on the receiving substrate (207). A faster assembly rate, a smaller chip size, and a lower profile can be achieved. |
