| 摘要 |
In the case of a component with component structures that generate heat loss on an active side of the substrate, it is proposed to apply a heat conductor on the rear face of the component substrate, said rear face having a second coefficient of thermal conductivity αLS that is substantially higher than the first coefficient of thermal conductivity αS of the substrate. The heat dissipation then occurs across the heat conductor and across connecting means that connect the substrate to a carrier. |
