| 摘要 |
A semiconductor switch device that is provided with a semiconductor switch main body part 10 that has a plurality of layered semiconductor switch chips 11 and a control part 12, with a plurality of first terminals 20, and with a plurality of second terminals 30. The connection state of each of the first terminals 20 and each of the second terminals 30 is changed by the semiconductor switch main body part 10. Each of the semiconductor switch chips 11 has a plurality of in-chip signal lines 14, 15, a connection-state changing part 13, and a plurality of non-contact communication parts 16. Each of the non-contact communication parts 16 can communicate in the layering direction in a non-contact manner with the other non-contact communication parts 16. The first terminals 20 and the second terminals 30 are respectively connected to the in-chip signal lines 14, 15 of the semiconductor switch chips 11. The connection state between the plurality of first terminals 20 and the plurality of second terminals 30 is changed as a result of the connection-state changing part 13 of each of the semiconductor switch chips 11 changing the connection state between the plurality of in-chip signal lines 14, 15. |
