发明名称 |
MOLDING DIE AND RESIN MOLDING DEVICE |
摘要 |
The present invention addresses the problem of providing a molding die whereby misalignment or dropout of a workpiece retained on a die clamp surface is prevented, and large size in a resin package part can be ensured. As a means for solving this problem, a workpiece retaining part (6d) for pressing against an external peripheral surface of a workpiece (W) and retaining the workpiece (W) is provided on an upper die clamp surface (6a) in a molding die (6), the workpiece retaining part (6d) being disposed facing the workpiece (W) at a plurality of locations along the outer shape of the workpiece (W). |
申请公布号 |
WO2017010319(A1) |
申请公布日期 |
2017.01.19 |
申请号 |
WO2016JP69652 |
申请日期 |
2016.07.01 |
申请人 |
APIC YAMADA CORPORATION |
发明人 |
NAKAZAWA, Hideaki;NAKAJIMA, Kenji;OKAMOTO, Masashi |
分类号 |
B29C33/12;B29C43/18;B29C43/32;B29C43/36;B29L9/00;H01L21/56 |
主分类号 |
B29C33/12 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|