发明名称 MOLDING DIE AND RESIN MOLDING DEVICE
摘要 The present invention addresses the problem of providing a molding die whereby misalignment or dropout of a workpiece retained on a die clamp surface is prevented, and large size in a resin package part can be ensured. As a means for solving this problem, a workpiece retaining part (6d) for pressing against an external peripheral surface of a workpiece (W) and retaining the workpiece (W) is provided on an upper die clamp surface (6a) in a molding die (6), the workpiece retaining part (6d) being disposed facing the workpiece (W) at a plurality of locations along the outer shape of the workpiece (W).
申请公布号 WO2017010319(A1) 申请公布日期 2017.01.19
申请号 WO2016JP69652 申请日期 2016.07.01
申请人 APIC YAMADA CORPORATION 发明人 NAKAZAWA, Hideaki;NAKAJIMA, Kenji;OKAMOTO, Masashi
分类号 B29C33/12;B29C43/18;B29C43/32;B29C43/36;B29L9/00;H01L21/56 主分类号 B29C33/12
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