| 发明名称 |
DOUBLE INSULATED HEAT SPREADER |
| 摘要 |
An apparatus for thermal management for an electric device. In one embodiment the apparatus comprises a primary heat spreader disposed within an enclosure that contains a printed circuit board (PCB) populated with at least one electrical component, wherein the primary heat spreader is thermally conductive and wherein the interior of the enclosure is at least partially filled with an encapsulating material; a secondary heat spreader coupled to an exterior face of a first wall of the enclosure, wherein the secondary heat spreader is thermally conductive; and a thermal interface coupled between the primary head spreader and the PCB, wherein the thermal interface is thermally conductive and electrically insulating. |
| 申请公布号 |
US2017020033(A1) |
申请公布日期 |
2017.01.19 |
| 申请号 |
US201615280567 |
申请日期 |
2016.09.29 |
| 申请人 |
Enphase Energy, Inc. |
发明人 |
Linderman Ryan |
| 分类号 |
H05K7/20;H01L33/64;H05K1/18;H02M7/00;H05K1/02;H01L33/48;H02S40/42 |
主分类号 |
H05K7/20 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. An apparatus for thermal management for an electric device, comprising:
a primary heat spreader disposed within an enclosure that contains a printed circuit board (PCB) populated with at least one electrical component, wherein the primary heat spreader is thermally conductive and wherein the interior of the enclosure is at least partially filled with an encapsulating material; a secondary heat spreader coupled to an exterior face of a first wall of the enclosure, wherein the secondary heat spreader is thermally conductive; and a thermal interface coupled between the primary head spreader and the PCB, wherein the thermal interface is thermally conductive and electrically insulating. |
| 地址 |
Petaluma CA US |
