DIE BONDING TO A BOARD

摘要

A method of bonding a plurality of die having first and second metal layers on a die surface to a board, comprising placing a first die onto a board comprising one of a ceramic or substrate board or metal lead frame having a solderable surface and placing the first die and the board into a reflow oven. The method includes reflowing at a first reflow temperature for a first period until the first metal board layer and at least one of the first and second metal die layers of the first die form an alloy to adhere the first die to the board. The alloy has a melting temperature higher than the first reflow temperature. Accordingly, additional die may be added at a later time and reflowed to attach to the board without causing the bonding of the first die to the board to fail.

主权项

1. A method of bonding a plurality of die having a plurality of metal layers on a die surface to a board or metal lead frame, comprising:
placing a first die onto a solderable surface of the board or the metal lead frame, the board comprising one of a ceramic board or substrate board, or a metal lead frame wherein a top metal die layer is disposed against the solderable surface; first reflowing at least one of first and second metal die layers of the first die at a first reflow temperature for a first period to form a first alloy to create a bond between the first die and the board or metal lead frame; and wherein the first alloy has a melting temperature that is higher than the first reflow temperature.