THERMAL ENHANCEMENT FOR QUAD FLAT NO LEAD (QFN) PACKAGES

摘要

Integrated circuit packages with enhanced thermal characteristics are provided. For example, in embodiments, a QFN (quad flat no lead) package includes a die pad that extends to at least one pinless edge of the QFN package body. A portion of the die pad further extends towards a top surface of the QFN package body. By doing so, a low impedance thermal path from a die included in the QFN package to the top of the QFN package body is formed, which causes heat generated by the die to dissipate from one or more sides and the top of the QFN package, and ultimately to the surrounding environment. Furthermore, the path travelled by the heat in a circuit board coupled to the QFN package is shortened, thereby protecting electrical components coupled thereto.

主权项

1. A quad flat no-lead (QFN) package, comprising:
a body having opposing first and second surfaces and a plurality of perimeter edges, the body comprising:
a die pad having one or more first surfaces and a second surface opposing the one or more first surfaces of the die pad, a first of the one or more first surfaces of the die pad configured to mount an integrated circuit die, the second surface of the die pad forming a portion of the second surface of the body, anda plurality of pins peripherally positioned along a subset of the perimeter edges of the second surface of the body, at least one of the perimeter edges being pinless; and the die pad extending to at least one pinless perimeter edge of the body.