Integrated PCB Interconnect System

摘要

An electronic assembly and device are provided. The electronic assembly includes a first circuit board, with PCB pads located adjacent to an edge of the circuit board, and a corresponding plurality of contacts, each contact soldered to one of the PCB pads. Each contact has a first portion, soldered to the PCB pad, and a second portion that extends past the edge of the circuit board and forms a leaf spring. The leaf spring compresses when placed in contact with a PCB pad of a second circuit board, where the PCB pad is substantially coplanar with a surface of the second circuit board. A restoring force of the second portion maintains contact between the second portion and the PCB pad of the second circuit board. The contact forms an electrical connection between the PCB pad of the first circuit board and the PCB pad of the second circuit board.

主权项

1. An electronic assembly, comprising:
a first circuit board, comprising a plurality of PCB pads located adjacent to one or more edges of the first circuit board; and a corresponding plurality of contacts, each contact soldered to an associated PCB pad of the first circuit board, wherein
each contact comprises a first portion configured to contact and be soldered to the associated PCB pad of the first circuit board and a second portion configured to extend past the adjacent edge of the circuit board and form a leaf spring configured to compress when placed in contact with a PCB pad of a second circuit board, the PCB pad of the second circuit board substantially coplanar with a surface of the second circuit board, anda restoring force of the second portion configured to maintain contact between the second portion and the PCB pad of the second circuit board, the contact forming an electrical connection between the PCB pad of the first circuit board and the PCB pad of the second circuit board.