| 发明名称 |
CAPACITOR SENSOR STRUCTURE, CIRCUIT BOARD STRUCTURE WITH CAPACITOR SENSOR, AND PACKAGE STRUCTURE OF CAPACITIVE SENSOR |
| 摘要 |
A capacitive sensor structure includes: a substrate; a multilayer wire structure, disposed on the substrate to form a passive sensing circuit; and a semiconductor chip, formed thereon a control circuit, fixedly mounted on a surface of the substrate and electrically connected to the multilayer wire structure. |
| 申请公布号 |
US2017017823(A1) |
申请公布日期 |
2017.01.19 |
| 申请号 |
US201615193585 |
申请日期 |
2016.06.27 |
| 申请人 |
MStar Semiconductor, Inc. |
发明人 |
Chang Ming-Chung;LIU TZU WEI |
| 分类号 |
G06K9/00;H01L23/31;H01L23/58;H01L23/498;H01L23/18 |
主分类号 |
G06K9/00 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A capacitive fingerprint sensor structure, comprising:
a substrate; a multilayer wire structure, disposed on the substrate, comprising a plurality of sensing electrodes to form a passive sensing circuit; and a semiconductor chip, fixedly mounted on a surface of the substrate, electrically connected to the multilayer wire structure; wherein, the multilayer wire structure is formed by a redistribution layer (RDL) process. |
| 地址 |
Hsinchu Hsien TW |
