INERT ANODE ELECTROPLATING PROCESSOR AND REPLENISHER

摘要

An electroplating processor has a vessel holding an electrolyte. An inert anode in the vessel has an anode wire within an anode membrane tube. A head for holds a wafer in contact with the electrolyte in the vessel. The wafer is connected to a cathode. A catholyte replenisher is connected to the vessel. The catholyte replenisher adds metal ions into the catholyte by moving ions of a bulk metal through a catholyte membrane in the catholyte replenisher.

主权项

1. An electroplating system comprising:
at least one electroplating vessel with at least one inert anode in contact with a process anolyte; a head for holding a wafer with a conductive seed layer in contact with the vessel-catholyte; a contact ring having electrical contacts for making electrical contact to the conductive seed layer and for sealing to the wafer; a first voltage source connecting the at least one inert anode to the conductive seed layer, with the first voltage source causing electrical current to flow between the anode and the conductive seed layer, which causes a conversion of water at the inert anode into oxygen gas and hydrogen ions and the deposit of copper ions from the vessel-catholyte onto the wafer; an external three-compartment processor for replenishing the vessel-catholyte, including:
a first compartment containing bulk copper material and a low acid electrolyte;a second compartment containing vessel-catholyte and separated from the first compartment by a first membrane;a third compartment containing an inert cathode and process anolyte and separated from the second compartment by a second membrane; and a second voltage source connecting the bulk anode material to the inert cathode, with the second voltage source causing electrical current to flow between the inert cathode and the conductive seed layer, which causes erosion of bulk copper material into copper ions that carry current across the first membrane to replenish the vessel-catholyte.