发明名称 PHOTOSENSITIVE RESIN COMPOSITION
摘要 Provided is a photosensitive resin composition having satisfactory development properties and no irregularities while ion migration is prevented. A photosensitive resin composition containing a reactive polymer having a carboxyl group and an ethylenically unsaturated double-bond group, a free-radical-based stabilizer, and a photo-acid generator, wherein the photosensitive resin composition is characterized in that the acid value of the reactive polymer is 40 to 100 mg KOH/g, the chlorine content of the reactive polymer is 150 ppm or less, and the free-radical-based stabilizer is selected from hindered amines or hindered amine-based derivatives; and a cured material using said photosensitive resin composition.
申请公布号 WO2017010534(A1) 申请公布日期 2017.01.19
申请号 WO2016JP70754 申请日期 2016.07.13
申请人 ROHM AND HAAS ELECTRONIC MATERIALS LLC 发明人 KUSHIDA, Shugaku;HAGA, Mitsuru;KAINUMA, Kunio
分类号 G03F7/004;C08F290/12;G03F7/038 主分类号 G03F7/004
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