发明名称 |
PHOTOSENSITIVE RESIN COMPOSITION |
摘要 |
Provided is a photosensitive resin composition having satisfactory development properties and no irregularities while ion migration is prevented. A photosensitive resin composition containing a reactive polymer having a carboxyl group and an ethylenically unsaturated double-bond group, a free-radical-based stabilizer, and a photo-acid generator, wherein the photosensitive resin composition is characterized in that the acid value of the reactive polymer is 40 to 100 mg KOH/g, the chlorine content of the reactive polymer is 150 ppm or less, and the free-radical-based stabilizer is selected from hindered amines or hindered amine-based derivatives; and a cured material using said photosensitive resin composition. |
申请公布号 |
WO2017010534(A1) |
申请公布日期 |
2017.01.19 |
申请号 |
WO2016JP70754 |
申请日期 |
2016.07.13 |
申请人 |
ROHM AND HAAS ELECTRONIC MATERIALS LLC |
发明人 |
KUSHIDA, Shugaku;HAGA, Mitsuru;KAINUMA, Kunio |
分类号 |
G03F7/004;C08F290/12;G03F7/038 |
主分类号 |
G03F7/004 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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