| 发明名称 |
COMPRESSIBLE THERMAL INTERFACE MATERIALS |
| 摘要 |
Provided is a compressible thermal interface material including a polymer, a thermally conductive filler, and a phase change material. A formulation for forming a compressible thermal interface material and an electronic component including a compressible thermal interface material are also provided. |
| 申请公布号 |
US2017018481(A1) |
申请公布日期 |
2017.01.19 |
| 申请号 |
US201515117862 |
申请日期 |
2015.02.04 |
| 申请人 |
ZENG Liang;LIU Ya Qunn;CHANG Jerry;DING Zhe;WANG Wei Jun;HUANG Hong Min;HONEYWELL INTERNATIONAL INC. ;Bright ZHANG |
发明人 |
Zeng Liang;Liu Ya Qun;Chang Wei;Zhang Liqiang;Ding Zhe;Wang Wei Jun;Huang Hong Min |
| 分类号 |
H01L23/373;C09K5/06;H01L23/367 |
主分类号 |
H01L23/373 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
Morristown NJ US |
