发明名称 |
INLINE BURIED METAL VOID DETECTION BY SURFACE PLASMON RESONANCE (SPR) |
摘要 |
A method and apparatus are provided for using SPR to detect buried voids in a semiconductor wafer inline post metal deposition. Embodiments include forming a first, a second, and a third metal structure in a first, a second, and a third adjacent die of a wafer; performing a SPR on the first, second, and third metal structures inline; detecting a first, a second, and a third SPR wavelength corresponding to the first, second, and third metal structures, respectively; comparing a difference between the first SPR wavelength and the second SPR wavelength and a difference between the third SPR wavelength and the first SPR wavelength against a threshold value; and determining a presence or an absence of a buried void in the first metal structure based on the comparison. |
申请公布号 |
US2017016822(A1) |
申请公布日期 |
2017.01.19 |
申请号 |
US201514800940 |
申请日期 |
2015.07.16 |
申请人 |
GLOBALFOUNDRIES Inc. |
发明人 |
JAYASEELAN Sabarinath;PATIL Suraj Kumar |
分类号 |
G01N21/552;G01N21/95 |
主分类号 |
G01N21/552 |
代理机构 |
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代理人 |
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主权项 |
1. A method comprising:
forming a first, a second, and a third metal structure in a first, a second, and a third adjacent die of a wafer; performing a surface plasmon resonance (SPR) on the first, second, and third metal structures inline; detecting a first, a second, and a third SPR wavelength corresponding to the first, second, and third metal structures, respectively; comparing a difference between the first SPR wavelength and the second SPR wavelength and a difference between the third SPR wavelength and the first SPR wavelength against a threshold value; and determining a presence or an absence of a buried void in the first metal structure based on the comparison. |
地址 |
Grand Cayman KY |