| 发明名称 |
LITHOGRAPHY PROCESS FOR THE ENCAPSULATION OF PATTERNED THIN FILM COATINGS |
| 摘要 |
A single lithography process for multi-layer metal/dielectric coatings using a series of developing, baking, and lifting steps to coat two or more thin films without re-patterning that results in the encapsulation and profile optimization of multi-spectral patterned thin film coatings is disclosed. |
| 申请公布号 |
WO2017011723(A1) |
申请公布日期 |
2017.01.19 |
| 申请号 |
WO2016US42419 |
申请日期 |
2016.07.15 |
| 申请人 |
PIXELTEQ, INC. |
发明人 |
LOVELADY, Heather;VARGHESE, Ronnie |
| 分类号 |
C23C18/22;C23C28/02;G03F1/80 |
主分类号 |
C23C18/22 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
|
| 地址 |
|
