| 摘要 |
The present invention relates to an electronic arrangement (1) at least comprising a circuit component carrier (2) and an electrical component (8) which is preferably an electrical resistor (9), wherein the circuit component carrier (2) has a substrate (3) and electrical conductors which are preferably fitted to the substrate and are conductor tracks (4, 5, 6, 7) for example, and wherein the electrical component (8) has at least two connections (10, 11) and each of the at least two connections (10, 11) is fitted to the circuit component carrier (2) by means of electrically conductive adhesive (12). For advantageous development, the invention proposes that each of the at least two connections (10, 11) is fitted to the circuit component carrier (2) by means of two adhesive bonds (14, 15, 16, 17) which are separate from one another and have electrically conductive adhesive (12). The invention also relates to a method for producing such an electronic arrangement (1). |
