发明名称 |
SOLID-SOURCE DIFFUSED JUNCTION FOR FIN-BASED ELECTRONICS |
摘要 |
A solid source-diffused junction is described for fin-based electronics. In one example, a fin is formed on a substrate. A glass of a first dopant type is deposited over the substrate and over a lower portion of the fin. A glass of a second dopant type is deposited over the substrate and the fin. The glass is annealed to drive the dopants into the fin and the substrate. The glass is removed and a first and a second contact are formed over the fin without contacting the lower portion of the fin. |
申请公布号 |
US2017018658(A1) |
申请公布日期 |
2017.01.19 |
申请号 |
US201415121879 |
申请日期 |
2014.07.14 |
申请人 |
Intel Corporation |
发明人 |
HAFEZ Walid M.;JAN Chia-Hong |
分类号 |
H01L29/8605;H01L29/66;H01L29/808 |
主分类号 |
H01L29/8605 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
Santa Clara CA US |