发明名称 |
SEMICONDUCTOR MEMORY DEVICE AND METHOD FOR MANUFACTURING THE SAME |
摘要 |
According to one embodiment, a semiconductor memory device includes a stacked body including a plurality of electrode films and a plurality of insulating films, the plurality of electrode films and the plurality of insulating films being alternately stacked on each other, a semiconductor pillar extending in a stacking direction of the stacked body, and a charge storage film provided between the electrode films and the semiconductor pillar and extending linearly in the stacking direction of the stacked body. A stacking-direction width of an edge portion of the electrode films on side of the semiconductor pillar is shorter than a stacking-direction width of the electrode films other than the edge portion of the electrode films. |
申请公布号 |
US2017018563(A1) |
申请公布日期 |
2017.01.19 |
申请号 |
US201514846052 |
申请日期 |
2015.09.04 |
申请人 |
Kabushiki Kaisha Toshiba |
发明人 |
Nishida Daisuke |
分类号 |
H01L27/115;H01L21/28 |
主分类号 |
H01L27/115 |
代理机构 |
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代理人 |
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主权项 |
1. A semiconductor memory device comprising:
a stacked body including a plurality of electrode films and a plurality of insulating films, the plurality of electrode films and the plurality of insulating films being alternately stacked on each other; a semiconductor pillar extending in a stacking direction of the stacked body; and a charge storage film provided between the electrode films and the semiconductor pillar and extending linearly in the stacking direction of the stacked body, a stacking-direction width of an edge portion of the electrode films on side of the semiconductor pillar being shorter than a stacking-direction width of the electrode films other than the edge portion of the electrode films. |
地址 |
Minato-ku JP |