发明名称 SEMICONDUCTOR MEMORY DEVICE AND METHOD FOR MANUFACTURING THE SAME
摘要 According to one embodiment, a semiconductor memory device includes a stacked body including a plurality of electrode films and a plurality of insulating films, the plurality of electrode films and the plurality of insulating films being alternately stacked on each other, a semiconductor pillar extending in a stacking direction of the stacked body, and a charge storage film provided between the electrode films and the semiconductor pillar and extending linearly in the stacking direction of the stacked body. A stacking-direction width of an edge portion of the electrode films on side of the semiconductor pillar is shorter than a stacking-direction width of the electrode films other than the edge portion of the electrode films.
申请公布号 US2017018563(A1) 申请公布日期 2017.01.19
申请号 US201514846052 申请日期 2015.09.04
申请人 Kabushiki Kaisha Toshiba 发明人 Nishida Daisuke
分类号 H01L27/115;H01L21/28 主分类号 H01L27/115
代理机构 代理人
主权项 1. A semiconductor memory device comprising: a stacked body including a plurality of electrode films and a plurality of insulating films, the plurality of electrode films and the plurality of insulating films being alternately stacked on each other; a semiconductor pillar extending in a stacking direction of the stacked body; and a charge storage film provided between the electrode films and the semiconductor pillar and extending linearly in the stacking direction of the stacked body, a stacking-direction width of an edge portion of the electrode films on side of the semiconductor pillar being shorter than a stacking-direction width of the electrode films other than the edge portion of the electrode films.
地址 Minato-ku JP