SEMICONDUCTOR DEVICE AND METHOD

摘要

Disclosed herein is a semiconductor device that includes a semiconductor die and a substrate including a first surface and a second surface. The substrate includes a conductive circuit and an insulative material over the conductive circuit. The semiconductor die is attached to the second surface. The semiconductor device further includes an interconnect joint structure in the substrate creating a capture pad including a middle copper layer, an adjacent top nickel layer, and an adjacent bottom nickel layer. A method for making a semiconductor device is further disclosed.

主权项

1. A semiconductor device comprising:
a semiconductor die; a substrate including a first surface and a second surface, the substrate comprising a conductive circuit and an insulative material over the conductive circuit, wherein the semiconductor die is attached to the second surface; and an interconnect joint structure in the substrate creating a capture pad including a middle copper layer, an adjacent top nickel layer, and an adjacent bottom nickel layer.