METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, SEMICONDUCTOR MANUFACTURING APPARATUS, AND WAFER LIFT PIN-HOLE CLEANING JIG

摘要

To shorten a maintenance time of a semiconductor manufacturing apparatus and to improve productivity of a semiconductor manufacturing line. A semiconductor wafer is processed by the semiconductor manufacturing apparatus in which reaction product in the inside of a wafer lift pin hole was removed using a cleaning jig having a return on its tip part.

主权项

1. A method for manufacturing a semiconductor device, comprising the steps of:
a) forming a thin film on a principal plane of a semiconductor wafer; b) applying a photoresist film onto the thin film; c) forming a mask pattern by transferring a predetermined circuit pattern to the photoresist film by photolithography; and d) performing dry etching processing on the semiconductor wafer with a dry etching apparatus that removed reaction product inside a wafer lift pin hole using a cleaning jig having a return on its tip part.