VIA STRUCTURE AND CIRCUIT BOARD HAVING THE VIA STRUCTURE

摘要

The present disclosure provides a via structure and a multilayer circuit board including the via structure. The via structure is provided in three or more conductor layers in the same electrical network, the conductor layers overlapping with each other vertically and including at least one current input layer and at least one current output layer; wherein the via structure includes a plurality of rows of vias, each row of vias puncture through at least one current input layer and at least one current output layer, and a part of the rows of vias puncture through all of the conductor layers, and the other part of the rows of vias puncture through a part of the conductor layers. By using the via structure in the present disclosure, the vias are subject to even temperature and thus the lifetime of the circuit board is extended.

主权项

1. A via structure, provided in three or more conductor layers in the same electrical network, the conductor layers overlapping with each other vertically and comprising at least one current input layer and at least one current output layer;
wherein the via structure comprises a plurality of rows of vias, each row of vias puncture through at least one current input layer and at least one current output layer, and a part of the rows of vias puncture through all of the conductor layers, and the other part of the rows of vias puncture through a part of the conductor layers.