| 发明名称 |
INTEGRATED CIRCUIT CHIP FABRICATION LEADFRAME |
| 摘要 |
One example includes a conductive leadframe configured to couple to an integrated circuit (IC) chip die on a contact surface of the IC chip die. The conductive leadframe includes a plurality of chip-pin connections configured to facilitate conductive coupling to bond pads of the IC chip die via conductive lead wires. The conductive leadframe also includes a support beam that extends across the conductive leadframe along the contact surface of the IC chip die to enable support of the IC chip die to the conductive leadframe at a plurality of support locations during testing of the IC associated with the IC chip die. |
| 申请公布号 |
US2017018483(A1) |
申请公布日期 |
2017.01.19 |
| 申请号 |
US201514985737 |
申请日期 |
2015.12.31 |
| 申请人 |
TEXAS INSTRUMENTS INCORPORATED |
发明人 |
Pitts Robert L.;Stark Leslie E. |
| 分类号 |
H01L23/495;H01L23/00 |
主分类号 |
H01L23/495 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A conductive leadframe configured to couple to an integrated circuit (IC) chip die on a contact surface of the IC chip die, the conductive leadframe comprising:
a plurality of chip-pin connections configured to conductively couple to bond pads of the IC chip die via conductive lead wires; and a support beam that extends across the conductive leadframe along the contact surface of the IC chip die to enable support of the IC chip die with respect to the conductive leadframe at a plurality of support locations during testing of the IC associated with the IC chip die. |
| 地址 |
DALLAS TX US |
