Die Packages and Methods of Manufacture Thereof

摘要

Die packages and method of manufacturing the same are disclosed. In an embodiment, a method of manufacturing a die package may include forming an encapsulated via structure including at least one via, a polymer layer encapsulating the at least one via, and a first molding compound encapsulating the polymer layer; placing the encapsulated via structure and a first die stack over a carrier, the at least one via having a first end proximal the carrier and a second end distal the carrier; encapsulating the first die stack and the encapsulated via structure in a second molding compound; and forming a first redistribution layer (RDL) over the second molding compound, the first RDL electrically connecting the at least one via.

主权项

1. A device, comprising:
an encapsulated via structure comprising at least one via, a polymer layer encapsulating the at least one via, and a first molding compound encapsulating the polymer layer; a first die stack adjacent the encapsulated via structure and having a topmost surface substantially level with a topmost surface of the encapsulated via structure; a second molding compound encapsulating the first die stack and the encapsulated via structure; and a first redistribution layer (RDL) over the second molding compound, the first RDL electrically connected to the at least one via.