Screening Methodology to Eliminate Wire Sweep in Bond and Assembly Module Packaging

摘要

Quality control testing for a batch of electronic modules. A series of tests are performed on manufactured electronic modules, including tests sensitive to the failure rate of previously tested modules. Specifically, a first test comprised of two phases is performed on the module batch. Further screening is then performed responsive to detection of a wire sweep failure in a subset of failed modules from the first test phase. The further screening is on modules that passed the first test phase and excludes modules that failed the first test phase.

主权项

1. A method for quality control review of one or more electronic modules comprising:
performing a first test on a first batch of modules to detect a gross failure associated with the modules, wherein each module includes a functional assembly of electronic components; performing a second test on failed modules of the first test, wherein the second test is an electromagnetic imaging test of one or more wires in the electronic module; and performing a third test on modules that pass the second test, the third test comprising an electronic current leakage screening.