| 摘要 |
Disclosed is a mobile terminal, comprising a main board, main board support member, and rear housing used for mounting a chip; the rear housing is arranged on the main board side away from the chip; a heat-conductive layer is arranged between the chip and the rear housing; a first heat-dissipating layer is arranged between the rear housing and the heat-conductive layer; a first insulating layer is arranged between the first heat-dissipating layer and the rear housing. Also disclosed is a heat dissipation method for the described mobile terminal; when the chip of the mobile terminal generates heat, the heat is transferred to the heat-dissipating layer by means of the heat-conductive layer. |
