| 摘要 |
In the present invention, a sealed substrate on which a plurality of unit regions are formed is adsorbed to a cutting tool by a first adsorption opening disposed on the cutting tool and having a first adsorption surface area. Using a first rotating blade, cutting grooves are formed at at least some of the cutting lines of the sealed substrate which has been adsorbed. The sealed substrate is adsorbed to the cutting tool using a plurality of second adsorption openings disposed on the cutting tool. One of the second adsorption openings adsorbs one unit region utilizing a second surface area of the opening. Using a second rotating blade, the sealed substrate which has been absorbed to the cutting tool is cut at a cutting line of the sealed substrate. A unit adsorption surface area, which is included in the first adsorption surface area and adsorbs one unit region, is larger than the second adsorption surface area, and as a result, the sealed substrate having a warp is securely adsorbed to the cutting tool. As a result of the cutting grooves which were formed, the warp of the sealed substrate is reduced. |
