A wafer holding body according to the present invention comprises: a ceramic base body that is disk-shaped and that comprises a wafer mounting surface at an upper surface side; embedded in the base body, for example, an RF electrode; a metal terminal inserted from a lower surface side of the base body; and a connecting terminal that electrically connects the RF electrode and the metal terminal with one another; wherein the connecting terminal comprises a ceramic member preferably having a truncated cone shape of the same material as the base body and a metal layer covering the surface of the ceramic member; and wherein an upper edge portion of the metal layer is connected to the RF electrode and a lower edge portion of the metal layer is connected to the metal terminal via a metal member.
