LED DISPLAY AND MANUFACTURING METHOD THEREOF

摘要

A manufacturing method of a LED display is provided. A temporary substrate is provided, wherein the temporary substrate has a first adhesive layer and a plurality of first, second and third LED chips mounted on the first adhesive layer. A first transparent substrate is provided, the transparent substrate has a plurality of pixels disposed thereon, and each of the pixels comprises a first sub-pixel, a second sub-pixel and a third sub-pixel respectively surrounded by a light-insulating structure. Then, the temporary substrate and the first transparent substrate are bonded together, such that each of the first, second and third LED chips is correspondingly mounted in each of the first sub-pixels, the second sub-pixels and the third sub-pixels. After that, the temporary substrate is removed. A LED display manufactured by said method is also provided.

主权项

1. A first transparent substrate, comprising:
a plurality of pixels formed on the first transparent substrate, wherein each of the pixels comprises:
a first sub-pixel, a second sub-pixel and a third sub-pixel respectively surrounded by a light-insulating structure;a first wavelength transition layer formed in the first sub-pixel;a second wavelength transition layer formed in the second sub-pixel;a third wavelength transition layer formed in the third sub-pixel;an adhesive layer disposed on the first, second and third wavelength transition layers; anda first LED chip, a second LED chip and a third LED chip disposed on the adhesive layer in the first, second and third sub-pixels, respectively;wherein a length and a width of each of the first, second and third LED chips are less than or equal to 60 μm, and a length and a width of each of the pixels are less than or equal to 200 μm.